| 摘要 |
PURPOSE:To improve the effect of heat dissipation of a semiconductor chip by forming a heat-dissipating section having wide width at an end section on the connecting section side of a free lead interposing between a connecting section and a die pad section for a lead frame. CONSTITUTION:A die pad section 1 is connected to a connecting section 4 connecting a large number of lead sections 3 through free leads 2 in a lead frame. An IC chip is fixed to the die pad section 1, and molded with a resin up to a section shown in a dotted line 6, and a section shown in a chain line 7 is cut, thus detaching the connecting section 4. Consequently, the end sections of the lead sections 3 are exposed from a resin body and terminals are formed, but the end sections of the free leads 2 are also exposed at the same time. Heat-dissipating sections 5 having wide width are shaped at the end sections of the leads 2, and the sections are exposed from the resin body and left. Accordingly, the heat of a semiconductor chip fixed to the die pad section 1 is transmitted in the leads 2, and dissipated from the heat-dissipating sections 5. |
