| 摘要 |
NEW MATERIAL:2,6-Bis(3-aminophenoxy)pyridine expressed by formula I. USE:Useful as a raw material for polyimide resins having remarkably improved moldability and adhesive properties, expectable as heat-resistant resins of an entirely new system and further used as a raw material for polyamide resins and bismaleimides and a curing agent for epoxy resins. PREPARATION:A 2,6-dihalogenopyridine expressed by formula II (X is Cl or Br) is reacted with 3-aminophenol in the presence of caustic potash, etc., in an aprotic polar solvent, e.g. dimethyl sulfoxide, etc., at 120-240 deg.C, preferably 140-200 deg.C to afford the aimed compound expressed by formula I.
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