发明名称 |
Microcircuit packaging member. |
摘要 |
<p>A packaging member for microcircuits comprises a base element (1) having a projecting area (2) divided by intersecting slots (3) into teeth-like projections. A frame element (4) surrounds the base element (1) and defines a space in which a microcircuit can be housed with its substrate in contact with the teeth-like projections. The latter are made from a ductile material such as copper with high thermal conductivity. The nature of the base element enables the package to withstand thermal stress more easily.</p> |
申请公布号 |
EP0223475(A2) |
申请公布日期 |
1987.05.27 |
申请号 |
EP19860308541 |
申请日期 |
1986.11.03 |
申请人 |
THE M-O VALVE COMPANY LIMITED |
发明人 |
TAYLOR, ERIC ALBERT |
分类号 |
H01L23/367;H01L25/16;H05K1/03;H05K1/05;H05K3/00;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/367 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|