| 发明名称 |
EPOXY-RESIN/POLYSULFONE MOLDING COMPOUNDS FOR CURED PRODUCTS WITH EXCELLENT HUMIDITY AND CRACKING RESISTANCE |
| 摘要 |
Moulding compounds containing (a) a mixture of a solid epoxy resin with a 6-14 % by weight proportion of a polysulphone mixed intimately therewith, (b) a novolak curing agent and (c) an accelerator, result in the formation of cured resin products having excellent resistance to cracking, moisture and thermal shock. Cured resins of this type are used as embedding materials for electrical and semiconductor elements. |
| 申请公布号 |
EP0151553(A3) |
申请公布日期 |
1987.05.27 |
| 申请号 |
EP19850810027 |
申请日期 |
1985.01.28 |
| 申请人 |
CIBA-GEIGY AG |
发明人 |
HELFAND, DAVID;CHEETHAM, KEVIN J. |
| 分类号 |
C08G59/00;C08G59/40;C08G59/62;C08L63/00;C09J163/00;H01B3/40;H01L23/29;(IPC1-7):C08L63/00;C08L81/06;C08G59/50 |
主分类号 |
C08G59/00 |
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