| 摘要 |
PURPOSE:To perform an excellent bonding even if the surface of a conductor has an irregular surface by pressing a wire bonding forming region of the conductor having the irregular surface by a capillary without hole, forming the region smoothly and densely, and then bonding the wire to the region. CONSTITUTION:A capillary 1 having no hole is pressed to a conductor 2 having an irregular surface prior to a wire bonding, and a load is applied to form the irregular surface smooth and dense. It is effective to achieve an object to apply a supersonic wave simultaneously upon applying of the load. Then a bonding wire is bonded by a normal method to the smoothed surface of the conductor. Thus, the contact of the wire to the conductor is improved to complete a proper connection. Thus, even if the surface of the conductor has the irregular surface, the bonding having excellent bondability can be executed to improve the bonding improper rate. |
