发明名称 Semiconductor memory device and manufacturing method.
摘要 <p>This invention provides a semiconductor memory device for an integrated circuit comprising a semiconductor substrate (11) of a first conductivity type, a field insulation layer (12) on the semiconductor subatrate (11), and a switch. This switch includes a gate insulation layer (13), a gate electrode (14) on the gate insulation layer (13), and a pair of impurity regions (15, 16) of a second conductivity type in the substrate (11) adjacent to the gate electrode (14). The device also includes a capacitor including a first electrode (19) connected to one impurity region (16), a second electrode (21) connected to a predetermined voltage, insulation means (20) for separating the first and second electrodes (19, 21), and groove means extending into the substrate (11) for increasing the capacitive area of the first electrode (19). A method for making the device is also described.</p>
申请公布号 EP0223616(A2) 申请公布日期 1987.05.27
申请号 EP19860309110 申请日期 1986.11.20
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MAEDA, SATOSHI
分类号 H01L27/10;G11C11/34;H01L21/8242;H01L27/108;H01L29/08;H01L29/94 主分类号 H01L27/10
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