| 摘要 |
<p>PURPOSE:To prevent the moisture resistance from decreasing after dipping in solder by sealing a semiconductor element by specific epoxy resin composition. CONSTITUTION:The resin composition for sealing a semiconductor element contains epoxy resin (A), phenol resin (B), curable accelerator (C) and organopolysiloxane (D), and further contains a water repellency agent which mainly contains polyethylene of 1,000 or more of molecular weight. The epoxy resin composition uses epoxy resin, phenol resin, curable accelerator, organopolysiloxane, and polyethylene. The phenol resin acts as a curing agent is epoxy resin, preferably uses phenol novolac, cresol novolac. The accelerator preferably uses tertiary amine, quaternary ammonium salt, imidazoles, boron compounds. The content of the organopolysiloxane is set to 2-50wt% of organic component in epoxy resin composition. The water repellency agent mainly contains polyethylene of 1,000 or more of molecular weight.</p> |
