| 摘要 |
PURPOSE:To enable mounting density to be increased through a relatively simple construction, eliminate limitations on devices used or the construction adopted, simplify a bonding process and reduce cost, by connecting lead electrodes, a driving IC and patterns on a substrate to each other through bonding of a single sheet of wiring film. CONSTITUTION:Lead electrodes 121, a common electrode 108 and driving ICs 119 are connected to each other, and the driving ICs 119 and patterns 155 provided on a glass-epoxy resin plate 154 are connected to each other by the same film 157. An aluminum support 153 is so worked or machined that a pad of the lead electrodes 121, the common electrode 108 and the driving ICs 119, which enables the operation conventionally carried out by using two films to be performed in a single step by using a single film, and the patterns 155 provided on the glass-epoxy resin plate 154 are on the same plane. Accordingly, all points to be bonded can be simultaneously bonded by laser bonding.
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