Semiconductor junction temperature emulator

摘要

The present device includes a resistor network wherein the values of the resistors are chosen such that the heat generated by current passing through the resistors will be substantially equal to heat generated at a semiconductor junction which is to be cooled. The present device further includes a heat sink which is substantially identical to the heat sink employed to withdraw heat from the semiconductor junction to be cooled. Accordingly, the present device provides heat which is identical to the heat generated at the semiconductor junction and which heat remains ambient to the semiconductor junction to be cooled. The present device further includes a sensor which converts temperature to an electrical signal and which is located substantially in the center of the resistor network and at a distance from the heat sink that approximates the position of the semiconductor junction from its heat sink. The temperature to electrical signal sensor generates a control electrical signal whose value is commensurate with the temperature of the air at the location of the temperature to electrical signal sensor and that temperature is substantially identical to the temperature at the semiconductor junction. The control electrical signal is employed by a servo circuit to drive an air fan to move air over the semiconductor junction to cool it. However, the air passed over the junction is limited to the quantity necessary to prevent damage as compared to a maximum airflow. Hence, there is a reduction in acoustical noise and a saving in energy.