| 摘要 |
PURPOSE:To enhance the density of an electronic part chip by mounting the chip on a metal substrate to suppress a heat generated from the chip. CONSTITUTION:The surface of a metal substrate 20 is opened with a hole to expose a metal board 2, the hole 21 is plated, a metal foil 10 is etched to form a circuit layer 4, a recess 13 is formed to expose the board 2, and the layer 4 is energized to form a plating layer 7 on the exposed board 2. Thereafter, an electronic part chip 6 is mounted on a plated layer 17. The substrate 20 is used as the substrate of a printed circuit board 5 to diffused the heat of the chip 6 from the board 2 having excellent thermal conductivity. The plated layer 17 is formed on the exposed surface of the board 2 to mount the chip 6 on the layer 17 to prevent the board 2 from being oxidized, thereby improving a bonding reliability. |
