| 发明名称 |
Method of making raised relief circuit board with soldered connections having nomenclature applied thereto |
| 摘要 |
Nomenclature is applied to a soldermask surface employing a peel apart film prior to application of molten solder.
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| 申请公布号 |
US4668603(A) |
申请公布日期 |
1987.05.26 |
| 申请号 |
US19860878608 |
申请日期 |
1986.06.26 |
| 申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
TAYLOR, JR., HARVEY W. |
| 分类号 |
H05K3/28;G03F7/34;H05K1/02;H05K3/00;H05K3/06;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/28 |
| 代理机构 |
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