Mounting beam for preparing wafers

摘要

A self-dressing mounting beam for slicing wafers from ingots of various materials, especially semiconductors, is described. The mounting beam is a composite material comprising an organic polymer, particles of abrasive and hollow microspheres. The ingot is mounted on the beam and sliced using an inside diameter saw. The saw penetrates the mounting beam as well as the ingot, so that the self-dressing feature is realized with each pass of the blade.