发明名称 |
Anti-corrosion treatment for patterning of metallic layers |
摘要 |
An improved method is provided for defining interconnect patterns in an integrated circuit fabricated on a semiconductor wafer. The improvement comprises the step of immersing the wafer in a weak base solution, prior to etching a titanium-tungsten barrier layer, so as to remove from the wafer chlorides and flourides remaining as a result of a previous step of etching a conductor layer. In a preferred embodiment of the invention, a step of immersing the wafer in a strong acid solution is also performed to remove chlorides from the wafer.
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申请公布号 |
US4668335(A) |
申请公布日期 |
1987.05.26 |
申请号 |
US19850771386 |
申请日期 |
1985.08.30 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
MOCKLER, KENNETH J.;KITTLER, RICHARD C.;WARNER, GLENN S.;HSU, HOWARD F. |
分类号 |
H01L21/02;H01L21/3213;(IPC1-7):B44C1/22 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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