| 摘要 |
NEW MATERIAL:The epoxy resin of formula I (R<1>-R<3> are o-phenylene, m- phenylene or p-phenylene). EXAMPLE:The epoxy resin of formula II. USE:The resin has general merits of epoxy resin and gives hardened epoxy resin having excellent heat-resistance, water-resistance and mechanical properties such as elastic modulus. It is useful especially as an adhesive having high heat- resistance and water-resistance, an IC sealant, a matrix resin for fiber-reinforced plastic, an adhesive having high shear strength or a structural material resistant to high load. PREPARATION:The compound of formula I can be produced by adding a diamine of formula III to an epihalohydrin and subjecting the addition reaction product to dehydrohalogenation with an alkali.
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