发明名称 LEAD FRAME
摘要 PURPOSE:To prevent the generation of resin burrs from the side surface of a package body 5 after molding to the outside by a method wherein overhang parts extending to the resin sealing position of the side surface of the package body in the direction of the resin-sealed part of a dam are provided in an integral body. CONSTITUTION:A tab 2 is arranged at the center of a lead frame 1 and supported by tab-hanging leads 3 in two directions. The lead frame has inner leads 4 extending to the surrounding of the tab, outer leads 6 for external connection mounted on an external printed substrate by projecting outside the package body 5, and the dams 7 joining each lead between these leads 6 and 4 are formed in an integral body. The overhang parts 9 extending to the resin sealing position 8 of the side surface of the package body among respective inner leads in the direction of the resin-sealed part of this dam, i.e., in the direction of the tab. Thereby, the projection of resin sealing material from the side surface of the package body towards the dams at the time of resin sealing is prevented.
申请公布号 JPS6084850(A) 申请公布日期 1985.05.14
申请号 JP19830192372 申请日期 1983.10.17
申请人 HITACHI SEISAKUSHO KK 发明人 NAKAMURA ATSUSHI;NISHI KUNIHIKO;WAKASHIMA YOSHIAKI
分类号 H01L23/50;H01L23/28;H01L23/495 主分类号 H01L23/50
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