| 摘要 |
PURPOSE:To obtain flatly buried electrode or wirings which are not sunk by forming a hard anodic oxidation film on a soft aluminum film to relatively increase a resistance against polishing as compared with a projection in the recess of the aluminum film. CONSTITUTION:The steps to the formation of an aluminum film 4 is the same as those of a conventional example. Then, an anodic oxidation film 5 is formed by an anodic oxidation on the film 4. When polishing is proceeded, the film 5 of a projection A is removed by polishing, the aluminum is exposed to allow the film 5 to remain on a recess B. The aluminum on the projection A is abruptly reduced in the state that the polishing is proceeded, and becomes substantially the same height as the recess B. The film 5 still remains on the recess B. When the polishing step is finished, a PSG film layer 2 is exposed on the projection A, the film 5 is already removed on the recess B, and the aluminum layer is polished thereunder so that the projection A and the recess B becomes substantially the same height.
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