| 摘要 |
Apparatus is disclosed for electrically interfacing a circuit operable at one temperature with a circuit operable at another temperature, comprising a primary cooling or heating surface disposed inside a vacuum chamber which is thermally connected to the first circuit. Transmission lines may extend through the wall of the vacuum chamber to the second circuit which can be located outside. In one embodiment, the first circuit is operable at cryogenic temperatures and is fabricated on an elongated fused quartz substrate together with the transmission lines. The first circuit may be thermally connected to the primary surface via a secondary surface, which may itself be thermally connected to the primary surface via a flexible support and/or a thermal switch. The use of a flexible element in the construction of the apparatus prevents thermally induced movement from shattering the substrate. The primary surface may be cooled by a thermally conductive rod immersible in liquid helium; by the forced flow of liquid helium into a vessel located inside the vacuum chamber, the interior of which vessel is in thermal communication with the primary surface; by a closed cycle refrigerator; or by other means. |
