| 摘要 |
PURPOSE:To prevent peeling between a lead frame and a resin generated on the bending of leads, and to obtain a semiconductor device having high damp- proofing and corrosion resistance by bending the lead frame on a resin molding process or before said process in the semiconductor device in which a member acquired by connecting a semiconductor element and the lead frame by a wire is sealed with the resin. CONSTITUTION:The joining body of a chip 1, a tab 2, wires 3, and a previously bent lead frame 4 is held between a top force 5' and a bottom force 6' beforehand formed in conformity with the shape of the lead frame, and molded with a resin 7. Or the top force 5' and the bottom force 6' also function as a press mold bending the lead frame 4, thus connecting a bending process for the lead frame 4 and a molding process. |
