| 摘要 |
PURPOSE:To prevent a peeling phenomenon from occurring between a front surface plate and adhesion resin, by composing ultraviolet-ray hardened resin of high-molecular compound having a photosensitive group. CONSTITUTION:As ultraviolet-ray hardened resin, photosensitive epoxy resin is obtained in a structural formula, in which OH groups of epoxy resin obtained by polycondensing epichlorohydrin and bisphenol A are esterified with cinnamic acid and cinnamoyl groups photosensitive to light are made pendant on the resin. The obtained photosensitive epoxy resin is hardened by radiating ultravio let rays of a definite wavelength in use of a chemical lamp. This manufacturing method enables a contraction rate of ultraviolet-ray hardened resin 9 to be suppressed under 1%, and therefore a peeling phenomenon does not occur be tween a front surface plate 5 and a boundary plane.
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