| 摘要 |
PURPOSE:To improve the efficiency of heat dissipation of a radiation fin, and to miniaturize a heat-pipe cooling body by ventilating a space formed by a laminate consisting of the radiation fin fitted to a section not united with a heat-receiving body for a heat pipe and a side plate and concentrating and flowing cooling air. CONSTITUTION:A plurality of heat pipes 7 arranged in the direction parallel with a joint surface between a flat type semiconductor element and a heat- receiving body 6 are combined with the heat-receiving body 6 so that excellent heat transfer is acquired. Heat loss generated in the flat type semiconductor element is transmitted over the heat-receiving body 6, and transferred up to radiation fins 8. Transferred heat is transmitted over cooling air forced- ventilated in clearances in a laminate consisting of the radiation fins 8, both side surfaces thereof are covered with side plates 9, by a fan, etc., and carried away to the outside. Accordingly, the semiconductor element is cooled efficiently. |
