| 摘要 |
PURPOSE:To improve the operational efficiency of die bonding process by a method wherein two each of die bonding heads are arranged at a specified interval along the carrier path of lead frames to properly adjust the feed of lead frames on the carrier path. CONSTITUTION:Die bonding heads DB1, DB2 are arranged at the specified interval along the carrier path 11 of lead frames 10. A projecting plate 31 projecting the frame 10 on the carrier path 11 is fixed on the upper path of a slider block 32. The frame 10 projected on the specified position of carrier path 11 is intermittently shifted by cam followers 20b, 20a and slide cams 25, 21 respectively at the piece arrayal pitch or double distance to be aligned by projecting an alignment pin on a notch 5 of frame 10. Besides, the feed of frame 10 between heads DB1, DB2 is adjusted by a transfer pawl holder 13. Through these procedures, the operational efficiency of die bonding can be improved. |
