| 摘要 |
PURPOSE:To improve the operation characteristics of IC, by laminating a ceramic thin plate provided with a metalized surface for power supply on one surface and a ceramic thin plate provided with a metalized wiring for signal transmission, and making a cavity for sticking an IC in the center part of the laminated body to expose the matalized surface and wiring. CONSTITUTION:A thin ceramic plate 1 of about 0.3mm thick, on the surface of which a plurality of signal wiring 3 are provided, and a thin ceramic plate 2 of about 0.5mm thick which has metalized surfaces 5 and 6 for forming a resistor 4, etc. and ceramic frames 8 and 9 for sealing are laminated to form an IC package. In this laminated body, a cavity 11 to adhere an IC is made, on the surface of which a metalized layer is formed. On the peripheral part of the cavity, a wiring 3 and metalized surfaces 5 and 6 are provided which are connected to a metal thin plate lead 12 for power source and an electrode lead 13, respectively. Thus a package mounting an IC is obtained. |
