发明名称 MANUFACTURE OF ELECTRIC CIRCUIT SUPPORT
摘要 In a method of manufacturing supports for electrical circuits, a conductive coating is applied to both sides of a board. Holes are drilled in the coated board. A discontinuity is produced in the electrical conductivity around at least some of these holes on at least one side of the board to prevent electrolytic deposition on the walls of these holes. A conductive material is then deposited at predetermined positions by electrolysis. After both sides of the board and the walls of the holes have been coated with the conductive material, the aforementioned discontinuity in the electrical conductivity around some of the holes on at least one side of the board is obtained by removing this conductive material in localized areas around the holes concerned.
申请公布号 JPS62112395(A) 申请公布日期 1987.05.23
申请号 JP19860217337 申请日期 1986.09.17
申请人 ETUD E DASHISUTANSU TECHNIC:SOC 发明人 KUROODO JIYAN SHIYARURU JIYUURU BORUFURAMU
分类号 H05K3/00;H05K1/11;H05K3/04;H05K3/06;H05K3/10;H05K3/42 主分类号 H05K3/00
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