| 摘要 |
PURPOSE:To make high density wiring possible, by drawing out leads of individ ual LSI's to end parts in the manner in which their surfaces are arranged on a chip surface, and covering the whole surface with resin, when a plurality of LSI chips are piled up in the direction of thickness and mounted three- dimensionally in a case. CONSTITUTION:When a plurality of chip-mount body 1 are piled up in the direction of thickness and mounted in a case (not shown) by three-dimensional piling, leads 5 which are drown out from these mount bodies 1 are arranged on one or the other end surface of this structure body 6 in the manner in which a specified gap is kept and each surface is in regular order. Side-part fixing plates 21 and 22 which are lengthened in order to be emplayed later as an outerframe in the case of burying resin, are arranged in parall to one side surface and the other facing side surface of the structure body 6, and fixed by bolts 3 and nuts 4. The structure body 6 is constituted in this manner, the fixing plates 21 and 22 are employed as a resin injection frame, resin 9 like polyimide which exhibits thermal stability after curing is poured into the whole part, and thermal treatment is performed to cure it. Also the bend of leading does not occur, thereby.
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