| 摘要 |
PURPOSE:To prevent a wafer from being damaged by supporting the wafer after the lug of the support section of one of the first and second car is located reliably below the periphery of the wafer. CONSTITUTION:To extract a wafer 16 from a cartridge 1 and shift it into a basket 2, the support section 4a of an arm 4 is advanced from a position (1) in the figure through the basket 2 and is located at (2). Next, the support section 4a is located at (6) through (2)-(5) by the action of a link 26. The arm 4 is further advanced to locate the support section 4a at (7). At this time, the lug 4b of the support section 4a is located below the periphery of each wafer 16 near a main pillar 1a. Even if grooves of the main pillar 1a and an auxiliary pillar 1b have distortion in pitch and wafers 16 are not parallel to each other, the distortion near the main pillar 1a is minor, thus the lug 4b of the support section 4a does not collide against the wafer at the position (7) and is located below its periphery.
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