| 摘要 |
PURPOSE:To improve packaging density of a multiple chip package, by directly connecting a multiplayer substrate and a chip carrier with an insulating layer and a vertical wirings. CONSTITUTION:In this multiple chip package, input/output pins 3 are connected to the lower surface of a ceramic multilayer substrate 1 including a power source pattern 2 with silver solder. On the upper surface of the substrate, a plurality of polyimide insulating layers 5, in the surface of which a signal pattern 4 is formed, are arranged in a multilayer mode. On the uppermost polyimide insulating layer 5 in which vertical wirings 6 that are connected to the signal pattern 4 are formed, a chip carrier 7 is bonded to vertical wirings 8 and a polyimide insulating layer 9 which are formed at the bottom surface of the carrier. An IC chip 11 and leads 12 are provided in the chip carrier. Thus high- density packaging can be carried out. |
