| 摘要 |
<p>PURPOSE:To prevent ununiformity in thickness of a solder film, by providing a non-bonding part at a part of copper circuit plate with respect to an AlN plate, and forming a slit, which is in parallel with bonding lines at the non- bonding part. CONSTITUTION:Copper circuit plates 12 are bonded to both surfaces of an AlN plate 11 with an eutectic of oxygen in AlN and copper which is formed by heating. At a part of the copper circuit plate 12 which is to be soldered, a non-bonding part 13 which is not bonded to the AlN plate 11 is formed. A slit 14 is formed at the center of the non-bonding part 13 is parallel with bonding lines 15 of the AlN plate 11 and the copper circuit plate 12. When an external terminal 16 is soldered to the non-bonding part 13 of the copper circuit plate 12, the copper circuit part 12 is freely expanded and contracted at one side toward the non-bonding part 13 even if temperature is increased at the time of soldering. The plate 12 is laterally elongated and does not form an arc shape. As a result, solder 17 is flat, and the uniform film thickness is maintained. Thus the external terminal 16 can be rigidly soldered.</p> |
