发明名称 ELECTROPLATING SOLUTION
摘要 PURPOSE:To obtain a film having no difference in thickness between high and low current density parts with superior uniformity of electrodeposition by using an electroplating soln. contg. a water soluble salt of Ni, Co or Fe, a water soluble halide of an alkali metal, an alkaline earth metal or Al, and boric acid. CONSTITUTION:This electroplating soln. contains a water soluble salt of Ni, Co or Fe, 150-800g/l one or more kinds of electrically conductive salts selected among the water soluble sulfates and sulfamates of alkali metals, alaline earth metals and Al, and boric acid as a buffer.
申请公布号 JPS62109991(A) 申请公布日期 1987.05.21
申请号 JP19860003058 申请日期 1986.01.10
申请人 C UYEMURA & CO LTD 发明人 MURAKAMI TORU;UOTANI HIROSHI
分类号 C25D3/12;C25D3/20;C25D3/56 主分类号 C25D3/12
代理机构 代理人
主权项
地址