| 摘要 |
PURPOSE:To reduce an induced noise and to improve an S/N by coinciding a detection pattern position formed at a multi-layer wiring board on which a memory chip is loaded with the center plane of a driving coil. CONSTITUTION:Between Y-direction driving coils 10 arranged by keeping an interval of 1.5mm, etc., a multi-layer wiring board 5 on which the memory chip having the thickness of 1.4mm, etc., equipped with a detection pattern 9 at the height of 0.75mm from the lower plane of the board is loaded is inserted. Therefore, the position of the pattern 9 coincides with the center plane of the coil 10, and the induced noise due to the vertical component of a driving magnetic flux is not generated, and the induced noise on the pattern 9 is reduced, thereby the S/N of a magnetic bubble memory chip being improved.
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