| 摘要 |
PURPOSE:To enable the uniform start of deposition and to increase the rate of deposition by adding a very small amount of copper ions to an electroless nickel plating soln. CONSTITUTION:A surface to be plated is immersed in an electroless nickel plating soln. contg. nickel chloride, a hypophosphite and a pH buffer as essential components to form a nickel film on the surface. In this electroless nickel plating method, 0.1-4ppm copper ions are allowed to always exist in the plating soln. or a soln. contg. 0.1-4ppm copper ions is stuck to the surface to be plated before the surface is immersed in the plating soln. |
