(A) ;SELECTIVELY BONDING METHOD FOR METAL ON SILICON SUBSTRATE,申请号JP19850171551U-传众专利搜索

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发明名称	(A) ;SELECTIVELY BONDING METHOD FOR METAL ON SILICON SUBSTRATE
摘要
申请公布号	JPS6278816(U)	申请公布日期	1987.05.20
申请号	JP19850171551U	申请日期	1985.11.07
申请人		发明人
分类号	A47J27/21;A47J41/00;F24C7/02;F24C7/08;H05B3/00;H05B3/78;(IPC1-7):A47J27/21	主分类号	A47J27/21
代理机构		代理人
主权项
地址

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