| 摘要 |
PURPOSE:To simply obtain only good square product by concentrically bonding a semiconductor disk on a circular dummy plate having small radius when the disk is cut in a matrix state to drop improperly cut pieces having a profile of nonsquare shape cut from the outer periphery from the dummy plate to automatically remove the pieces. CONSTITUTION:When a laminate 2 formed by stacking semiconductor disks 1 and brazing between the disks is bonded to a glass plate 3 as a dummy plate having a diameter smaller than that of the disk 1, and cut at the sectional surface 5 of matrix state in a laminating direction to be divided into high voltage rectifiers 6 of square columnar state, improperly cut pieces 7 of incomplete square shape at the outer periphery are obtained in addition to the pieces of square-sectional shape. However, since the laminate 2 is bonded to the plate 3 of smaller radius, if the radius of the glass plate is proper, improperly cut pieces 7 are dropped by the glass plate at the time of cutting by a saw the bottom of the laminate 2 or the surface of the plate 3. When a high voltage rectifier 6 is cut, for example, at one side (d) from the laminate 2 of radius R, the radius (r) of the plate 3 designated by broken lines at the outer periphery is set to r=R-2<1/2>d. Then, the pieces 7 indicated by hatching are all disposed outside the plate 3. |
