An automatic edge grinder.

摘要

The edge grinder machine employs a centering station (13) in which a photosensor (14) measures a number of points on the periphery of a wafer (22) so that the shape of the wafer and location of the geometric center can be determined in a computer (19). A rotatable head (29) serves to position the geometric center of the wafer on a fixed axis and the wafer transferred to a grinding station (14) with the geometric center located on the central axis of a rotating chuck (68). During grinding, a grinding wheel (70) is moved in accordance with the differences between the detected shape of the wafer and a predetermined shape. The grinding wheel (70) is moved on an axis (y) perpendicular to an axis (x) passing through the centering station and grinding station in accordance with signals received from the computer (19).