| 摘要 |
PURPOSE:To obtain the title conductive paste which can be baked at low temp. and is inexpensive and capable of forming a circuit even on an enamel substrate by dispersing the base material, obtained by mixing copper oxide powder and low-softening point glass powder in a specified weight ratio, in an org. vehicle. CONSTITUTION:From 60-95wt% copper oxide powder and 40-5wt% low softening point glass powder (e.g., PbO-B2O3-SiO2 glass powder) are mixed. Then the obtained base material is dispersed in an org. vehicle (e.g., a soln. of ethyl cellulose in butylcarbitol) to obtain the desired conductive paste. Since the obtained conductive paste can be baked at >=600 deg.C, the cost of a baking furnace is reduced, and the paste itself can be produced at a low cost. Furthermore, the paste can be simultaneously baked along with a resistor and a dielectric paste which are baked at 500-650 deg.C in the atmosphere.
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