PROCESS FOR MAKING PRINTED CIRCUIT BOARDS WITH A CONDUCTIVE RIGID INDIVIDUAL METALLIC SUPPORT

摘要

A process for manufacturing a printed circuit having a conductive rigid metallic support that is well suited for UHF use. A circuit is engraved on one of two metallized surfaces of a substrate plate. After the circuit is formed, an epoxide adhesive film is used to secure the non-engraved surface to the conductive rigid metallic support. The resulting assembly is then machined.