发明名称 METHOD AND APPARATUS FOR SURFACE TREATING
摘要 PURPOSE:To prevent a surface to be treated from damaging, contaminating, rising at its temperature by controlling incident amount and direction to the surface with active particles as electrically neutral particles, and selecting particle seeds mainly reacted with the surface. CONSTITUTION:Active particles formed of an active particle generator 1 become electrically neutral by a neutralizer 2, are aligned in the directions by a direction controller 3, then incident to a wafer 4, and the wafer 4 is held through a temperature controller 5 at a sample base 6. A raw material gas is fed through a pipe 9 to a chamber 8, DC or high frequency voltage is applied to electrodes 10, 10' to generate a discharge. The type and the quantity of the active particles are controlled by the generating means. When the discharge gas type is varied and the type of the active particles, the pressure of the discharge gas and the incident power are altered, the quantity of the active particles can be changed. Thus, the surface of the sample can be accurately treated without damaging, contaminating rising of the temperature.
申请公布号 JPS62108525(A) 申请公布日期 1987.05.19
申请号 JP19850247025 申请日期 1985.11.06
申请人 HITACHI LTD 发明人 NINOMIYA TAKESHI;SUZUKI KEIZO;NISHIMATSU SHIGERU;OKADA OSAMI
分类号 H01L21/205;H01J37/30;H01L21/203;H01L21/265;H01L21/302;H01L21/3065 主分类号 H01L21/205
代理机构 代理人
主权项
地址