| 摘要 |
PURPOSE:To arrange each cell in a contacting manner with each other, and to scale down chip size by forming a plurality of cells, external terminals disposed, displacing positions mutually and an upper layer wiring connected to the external terminals. CONSTITUTION:Cells A-C each take rectangles, one sides thereof are shaped in predetermined length, and other sides are formed in arbitrary length. The cells A-C consist of circuit blocks having functions, such as amplifiers, detectors, gain controllers, etc. constituting an analog semiconductor integrated circuit, and power wirings 2-4 as lower wirings and grounding wirings 5-7 are each arranged to the sides in arbitrary length, and a plurality of external terminals connecting input/output wirings as lower wirings in the cells are shaped on the sides in predetermined length. The external terminals a1-a3 are formed on one side in predetermined length and the external terminals a4-a6 are shaped on the other side in the cell A, and the external terminals a1-a3 and the external terminals a4-a6 are mutually disposed zigzag, and the external terminals b1-b6 for the cell B and the external terminals c1-c6 for the cell C are also arranged similarly. Accordingly, each cell can be disposed brought into contact, and chip size can be scaled down. |
