| 摘要 |
PURPOSE:To permit simultaneous operation of upper face and lower face chamfering together with adaptation thereof to the chamber angle after alteration, without exchanging grindstones by forming a combination of chamber angle with the upper grinding face of either one chamfering grindstone and the lower grinding face of the other chamfering grindstone. CONSTITUTION:In the case of chamfering at 22 deg. for both upper and lower faces of a wafer, upper and lower positions of grindstones 10, 11 are set in such a manner that the inclined face 10b of the grindstone 10 can grind the circumferential lower face of the wafer and the inclined face 11a of the grindstone 11 can grind the circumferential upper face of the wafer. Furthermore, in the case of chamfering at 11 deg. for upper and lower faces of the wafer, contrary to the above, upper and lower positions of grindstones 10, 11 are set in such a manner that the inclined face 10a of the grindstone 10 can grind the circumferential lower face of the wafer and the inclined face 11b of the grindstone 11 can grind the circumferential upper face of the wafer. Then, chamfering at 22 deg. or 11 deg. for the circumferences of upper and lower faces of the wafer can be accomplished by grinding action of grindstones 10, 11.
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