发明名称 VAPOR PHASE TYPE SOLDERING DEVICE
摘要 PURPOSE:To eliminate local heating, to prevent the generation of a harmful gas and to eliminate the need for cleaning of a liquid tank by heating the heat transfer medium in an outside tank by a heater and indirectly heating the inert liquid in the inside tank. CONSTITUTION:The heater 25 and the heat transfer medium 27 are housed into the outside tank 23 provided on the outside of the inside tank 31 in the stage of evaporating the inert liquid 32 to be used for vapor phase type solder ing. The heat transfer medium 27 is heated by the heater 27 to indirectly heat the inert liquid 32 in the inside tank. Since the local heating of the inert liquid 32 is obviated, the generation of, for example, perfluoroisobutyerne harmful to the human body and hydrogen fluoride, etc. to corrode metal is prevented. The need for cleaning of the tank inside which was heretofore carriedout once a day is eliminated.
申请公布号 JPS62107861(A) 申请公布日期 1987.05.19
申请号 JP19850247733 申请日期 1985.11.05
申请人 TAMURA SEISAKUSHO CO LTD 发明人 ABE NOBUHIDE;TAKAHASHI TAKAO;ABE YOSHINOBU
分类号 H05K3/34;B23K1/015 主分类号 H05K3/34
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