| 摘要 |
PURPOSE:To simplify a process, to shorten a delivery time and to decrease the amount of materials to be used by making a semiconductor chip directly loaded onto a substrate and a semiconductor chip without performing protective- coating while containing a coated sheathing resin. CONSTITUTION:An external lead 4 is inserted to a glass epoxy substrate 1, a material connecting a semiconductor chip 2, a loading part 3 and the external lead 4 is printed or applied through application, etc., and the semiconductor chip 2 and the part 3 are mounted. Solder reflow and washing are executed when solder is used as an adhesive material, and Ag paste is baked when Ag paste is employed. The semiconductor chip 2 and the part 3 are mounted, the semiconductor chip is wired-bonded at a low temperature of 100-150 deg.C, and lastly the whole is coated with a sheathing resin 6. Phenol, silicone, etc. may also be used as the sheathing resin and dipping except powder coating, transfer molding, etc. are sheathing. Accordingly, processes are simplified and shortened, and a semiconductor-chip coating resin and a resin coating the whole substrate can be removed. |
