| 摘要 |
PURPOSE:To compensate a defective bit without requiring an independent ROM by generating a ROM for the compensation of the defective bit at the same substrate on which a solid-state image pickup element part is placed and forming a solid-state image pickup device. CONSTITUTION:A solid-state image element part 2 and a defective bit compensating ROM part 3 are generated independently on a silicon board 1. The silicon board 1 is mounted on a package 6, and bonding wires 7-7-8 and 7-3-4 are connected respectively to bonding pads 4-7-8 and 5-3-4 generated on the silicon board 1. A cover is attached in such a way that glass caps 8 are placed facing with each other on the upper part of the solid-state image part 2, and metallic caps 9 are placed facing with each other on the ROM part 3. And the characteristic of the solid-state image element 2 is inspected, and the bit position of the defective bit required to be compensated is stored at the ROM part 3.
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