发明名称
摘要 PURPOSE:To increase breaking strength by a method wherein the fixed quantities of elements belonging to a Pt group are contained in an Au alloy having high purity into which Au having high purity or one kind or more of Ca, Be, Ge, Ni, Fe, Co and Ag are contained at 0.0003-0.01W/O. CONSTITUTION:When at least one kind of Pd, Pt, Ir, Rh, Os and Ru is contained in an auric alloy having high purity containing a prescribed quantity of Au having high purity or one kind or more of the elements of Ca, Be, etc. at 0.0003-0.1W/O in the total amount, these Pt group elements are easily dissolved in Au or the Au alloy, are dispersed uniformly, and give distortion to the gratings of Au, and mechanical strength is increased. When Pt and Pd are particularly contained, breaking strength is further increased. On the other hand, this bonding wire displays similar excellent elongation percentage and joining property in case of the using of a hydrogen flame as compared to conventional wires.
申请公布号 JPS6222448(B2) 申请公布日期 1987.05.18
申请号 JP19790090126 申请日期 1979.07.16
申请人 TANAKA PRECIOUS METAL IND 发明人 MURAKAMI NORIMASA
分类号 H01L21/60 主分类号 H01L21/60
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