| 摘要 |
PURPOSE:To obtain a substrate for an electronic circuit suitable for reducing weight or high integration by a method wherein a base material of a three- dimensional network structure is formed into a composite material by filling resin in the open pores of the basic material, and at the same time, a resin layer is pasted on one of the faces of this composite material and is cured. CONSTITUTION:A molded material is molded of a starting material mainly constituted with silicon carbide fine powder. Then, the molded material is formed into a base material consisting of a silicon carbide porous substance and then, resin is filled in open pores of this base material, whereby a composite material is first formed. Resin-impregnated inorganic fiber clothes are laminated on this composite material to form a resin layer. After that, this resin layer is cured, thereby obtaining a substrate for an electronic circuit. A conductor circuit is formed on the substrate for an electronic circuit obtained by such a way.
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