| 摘要 |
PURPOSE:To obtain the titled resin composition excellent in storage stability, curability, etc., and excellent in the heat resistance, etc., of a cured product, by mixing a maleimide group-containing compound with an aromatic amine and a curing catalyst at a specified weight ratio. CONSTITUTION:The purpose heat-resistant resin composition is obtained by mixing 100pts.wt. compound (A) having at least one maleimide group in the molecule (e.g., 4,4'-diaminodiphenylmethane bismaleimide or methyleneditoluidinebismaleimide) with 5-50pts.wt. aromatic amine (B) (e.g., 4,4'-diaminodiphenyl sulfone or methyleneditoluidine) and 0.1-10pts.wt. curing catalyst (C) (e.g., N,N-dimethylbenzylamine or triphenylphosphine). The obtained resin composition can be suitably used as a material for the production of, especially, resins for multi-ply lamination, electroconductive pastes, sealing materials, etc.
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