| 摘要 |
PURPOSE:To prevent bonding force from degrading due to wafer probing by a method wherein a wafer probing pad in addition to bonding pads is provided in a scribe line region. CONSTITUTION:The number of pads in a scribe line region 1 may be doubled because probing pads 4 leading out of bonding pads 3 in both sides of a chip region are formed in the scribe line region 1. The area of the bonding pad 3 is 110mumX110mum, the width of the scribe line region 1 is 80mum, and the area of the probing pad 4 is 60mumX55mum. All these ensures an ample space for the scribe line region 1. With a large area of 60mumX55mum allotted to the probing pad 4, a reliable probe landing is ensured.
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