发明名称 FORMATION OF ELECTRODE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To form an excellent electrode pattern consisting of ReB6 on the part which is not masked by a photoresist film by a method wherein, after ReB6 has been vapor-deposited on a compound semiconductor substrate using a photoresist film as a mask, the ReB6 vapor-deposited on the photoresist film is removed together with the photoresist film using a stripping solution. CONSTITUTION:An SiO2 film 2 is formed on an N-type GaAs substrate 1, a quinone azide photoresist film 3, having phenol and cresol-novolac resin as the base, is formed thereon and the photoresist solution coated on the other part is removed. Besides, the SiO2 film 2 is etched using the photoresist film 2 as a mask. Then, an LaB6 film 4 is vapor-deposited at the room temperature using an electron gun. As a result, when a treatment is performed on the LaB6 film 4, having cracks on the surface, vapor-deposited on the photoresist film 3, using the photoresist stripping solution consisting of phenol and halogen organic solvent, the LaB6 film 4 is easily and completely peeled off together with the photoresist film 3. Lastly, an annealing is performed at a high temperature, and a Schottky diode is formed.
申请公布号 JPS62105421(A) 申请公布日期 1987.05.15
申请号 JP19850244054 申请日期 1985.11.01
申请人 AGENCY OF IND SCIENCE & TECHNOL 发明人 UCHIDA YOKO;YOKOZUKA TATSUO;TAKATANI SHINICHIRO;NAKAJIMA HISAO
分类号 H01L29/872;H01L21/28;H01L21/285;H01L21/338;H01L29/47;H01L29/80;H01L29/812 主分类号 H01L29/872
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