| 摘要 |
PURPOSE:To fix chip parts to a substrate in a highly precise manner by a method wherein the attached position of a chip part is corrected utilizing the balance of the spring force of the two elastic wires bonded between the chip part and the substrate. CONSTITUTION:A bonding agent 2 is painted on the prescribed place of a substrate 1, and a chip part 3 is fixed thereon temporarily. Then, two elastic wires 41 and 42 such as ribbon-like bonding wires and the like, for example, are bonded between the substrate and the chip part 3. At this time, the bonding position of the elastic wires 41 and 42 is set in the direction wherein the deviation (x) of the mounted position of the chip part is corrected. In the state wherein the bonding of the elastic wires 41 and 42 is finished, the unbalance of elastic force corresponding to the above-mentioned (x) is generated, but after a short time, the chip part 3 moves until the elastic force of the elastic wires 41 and 42 is brought into equilibrium as shown by the arrow (c) in the diagram. Then, the mounted position (b) of the chip part 3 is brought in coincidence with the true mounted position (a) with a very small error. |
