发明名称 Method for producing a multiphase thermal trip device
摘要 During the installation of the bimetallic elements (4), each bimetallic element (4) is mounted loosely on a slide (14), which is common to all the bimetallic elements (4), and is placed on a support (9) which is attached to a wall (10) of a housing (2). The slide (14) is guided displaceably in the housing (2) and interacts with a compensation bimetallic element (15) of a trip device. Each support (9) has a projecting part (9a) which is provided with a bearing surface (24) for that end (4a) of the associated bimetallic element (4) which is to be attached. A positioning element (25), which is in the form of a pin, engages in a recess in the bimetallic element (4), and holds said bimetallic element (4) in its position, projects beyond this bearing surface (24). The bimetallic elements (4) are subsequently attached to their supports (9) by means of electron-beam welding or laser welding. Since, before the bimetallic elements (4) are anchored, their ends (4b) which can be freely bent out come to rest on the common slide (14), these ends (4b) are necessarily aligned to one another. Readjustment of the bimetallic elements (4) is thus unnecessary. <IMAGE>
申请公布号 CH660646(A5) 申请公布日期 1987.05.15
申请号 CH19820002801 申请日期 1982.05.06
申请人 SPRECHER & SCHUH AG 发明人 HOFMANN, HEINRICH;HAENNI, KURT;FELLER, WILLY
分类号 H01H83/22;(IPC1-7):H01H69/01;H01H37/52;H01H71/16 主分类号 H01H83/22
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