| 摘要 |
A copper conductive paint for use on a porcelanized metal substrate, which comprises a powder mixture of 82 to 98.5% copper, 0.5 to 12% copper hydroxide, and 1 to 6% non-reducable borosilicate glass frit. 75 to 90 percent of the powder mixture is blended with 10 to 25 percent screening agent to form the copper conductive paint herein disclosed. The copper conductive paint is then screened and fired upon a porcelainized metal substrate in an inert atmosphere at approximately 900 DEG C. to form a copper conductor exhibiting improved adhesion characteristics. |
