| 摘要 |
PURPOSE:To improve the yield while cutting down the processes by a method wherein a carrier guide in the horizontal direction and a lift in the vertical direction are provided between semiconductor manufacturing device of each station so that wafers may be internally carried by driving a truck while assuring the wafers of high purity in the carrying processes. CONSTITUTION:A carrier guide 1 is installed in a semiconductor manufacturing plate while another carrier guide 3 is fixed between semiconductor manufacturing devices in the plant in horizontal state while a lift 4 is provided between the latter carrier guide 3 and a take out device of a wafer cassette 6 in vertical state. A wafer 5 as a work contained in the wafer cassette 5 is simultaneously arranged on a carrier truck 7 after making alignment with a holder 16 of the truck 7. When a drive motor 11 is supplied with a track command or power externally through an electric line 26 in such a state, a driving vehicle 8 travels at specified speed on the track of carrier guide 3. The carrier truck 7 and the driving vehicle 8 are automatically stopped on the table 31 of the lift 4 in the state as they are staying on the track.
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